Gold wire bonding semiconductor bonding machine welding machine manufacturer provides after-sales worry free
Gold wire bonding semiconductor bonding machine welding machine manufacturer provides after-sales worry free
Gold wire bonding semiconductor bonding machine welding machine manufacturer provides after-sales worry free
Gold wire bonding semiconductor bonding machine welding machine manufacturer provides after-sales worry free
Gold wire bonding semiconductor bonding machine welding machine manufacturer provides after-sales worry free
Gold wire bonding semiconductor bonding machine welding machine manufacturer provides after-sales worry free

Gold wire bonding semiconductor bonding machine welding machine manufacturer provides after-sales worry free

$96.69
Place of Origin
China
Shipping
Air Freight, Ocean Freight, Land Freight

Product Description

Overview

brand
Weichen
Does it support processing customization
Imported or not
Diameter of pump pressure plate B
Packaging specifications
Warranty period
Stripping range
Step memory capacity
material
yield
Chengxin
magnetizing voltage
Magnetic steel size
Pole size
grade
supply voltage
220V
Resolution
Working current
working voltage
Working air pressure
working temperature
power
300W
specifications
Processing quantity
Humidification amount
Foot length
Control form
Inventory age
type
sensitivity
Aluminum wire diameter
18~50 μ M (0.7-2mil)
torque
Supporting equipment
frequency
Air source
Hot pressing time
production capacity
Applicable objects
Applicable fields
Applicable production processes
input voltage
Transport medium
Feeding form
Placement speed
Spitting time adjustment
Number of feeders
Stability
Wire diameter
New and old degree
stroke
model
WE-2013
Pressure output
Scope of use
Floor area
amplitude
Quality Product Certification
type
weight
Spindle direction
speed
Automation level
Automatically
Automatic skip range
Maximum peeling length
Maximum cutting length
Maximum crimping force
Minimum peeling length
Minimum cutting length
Minimum throughput
Processing customization
yes
Minimum welding time
0.4s
Tail length
0-2mm
Overall dimensions
seven hundred × four hundred and sixty × 550mm
Is it a cross-border export exclusive source of goods
yes
Power consumption
300w
weight
30KG
Golden Ball Size
2-4 times the wire diameter can be set arbitrarily
welding temperature
60-400 ° C

Product Details

Gold wire bonding semiconductor bonding machine welding machine manufacturer provides after-sales worry free
Gold wire bonding semiconductor bonding machine welding machine manufacturer provides after-sales worry free
Gold wire bonding semiconductor bonding machine welding machine manufacturer provides after-sales worry free
Gold wire bonding semiconductor bonding machine welding machine manufacturer provides after-sales worry free
Gold wire bonding semiconductor bonding machine welding machine manufacturer provides after-sales worry free

Trading Area

Global

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