Overview
| brand | Yize | Processing customization | yes |
| Article number | YZ-WG01 | type | Semiconductor mold barrel injection head |
| product name | Tungsten steel cylinder and semiconductor injection head | Applicable mold types | Semiconductor packaging mold |
| Main processing equipment | Grinding machine, internal and external circular grinding | Mold material | Tungsten steel hard alloy |
| Grinding accuracy of grinding machine | 0.0005mm, 0.5 μ M | Concentricity | 0.002mm, 2 μ M |
| hardness | 85-95HR | quality system | ISO9001 |
| Number of processing equipment | 180 units | Number of testing equipment | 58 units |
| Main markets | Domestic, European, and American | ||
Product Details
Trading Area
Global