Overview
| brand | Suzhou Duma | model | DM-M300-M403E |
| Packaging/Specifications | 500g | packing | Canning |
| Minimum packaging quantity | one | encapsulation | Canned needle cylinder |
| Alloy components | Sn96.5/Ag3/Cu0.5 | melting point | 217 ℃ |
| viscosity | 200Pa.sPa · S | Granularity | twenty μ M~38 μ M |
| Cleaning method | Ultrasonic spray | Applicable scope | Semiconductor, chip industry |
| weight | 0.5kg | type | Clean free solder paste |
| Processing customization | yes | Tensile resistance | High tensile resistance, no metal enrichment |
| thermal shock | Strong thermal shock resistance, cold and hot cycling | colour | Grey paste |
| quantity | one hundred | Batch number | NO20230401 |
Product Details
Trading Area
Global