Overview
| brand | Duma Technology | model | DM-DM-M300 |
| Packaging/Specifications | 500g | packing | pot |
| Minimum packaging quantity | one | type | Halogen free and cleaning free |
| activity | Moderate activity | Preservation requirements | 5-10 ℃ |
| Alloy components | SnAg3Cu0.5 | melting point | 217 ℃ |
| viscosity | 70Pa · S | Granularity | twenty-five μ M~45 μ M |
| Cleaning angle | No cleaning required | Applicable scope | Platform welding, pulse welding, haba welding |
| Solder joint characteristics | Anti tensile, anti thermal cycling without enrichment | weight | 500g |
| Application occasions | Automotive electronics, LED, security, etc | Tin laying method | Glue dispensing or printing |
| encapsulation | Canning | quantity | one hundred |
| Batch number | NO20230301 | ||
Product Details
Trading Area
Global