WiFi chip ESP32-PICO-V3 Lexin Technology dual core Wi Fi&Bluetooth system level packaging SiP module
WiFi chip ESP32-PICO-V3 Lexin Technology dual core Wi Fi&Bluetooth system level packaging SiP module
WiFi chip ESP32-PICO-V3 Lexin Technology dual core Wi Fi&Bluetooth system level packaging SiP module
WiFi chip ESP32-PICO-V3 Lexin Technology dual core Wi Fi&Bluetooth system level packaging SiP module
WiFi chip ESP32-PICO-V3 Lexin Technology dual core Wi Fi&Bluetooth system level packaging SiP module
WiFi chip ESP32-PICO-V3 Lexin Technology dual core Wi Fi&Bluetooth system level packaging SiP module

WiFi chip ESP32-PICO-V3 Lexin Technology dual core Wi Fi&Bluetooth system level packaging SiP module

$0.73/Unit
Place of Origin
Shenzhen, Guangdong, China
Shipping
Ocean Freight, Land Freight, Air Freight

Product Description

Overview

brand
Lexin
model
ESP32-PICO-V3-1
Packaging/Specifications
packing
authentication
Minimum packaging quantity
Batch number
LEKJPICO-1
quantity
nine hundred and ninety-nine
application area
Image recognition/Mesh network/Home automation/Wearable electronic products, etc
inventory
In stock, available for ordering
Invoice Type
Special invoice
encapsulation
Original packaging
Saleable land
Global
processor
Xtensa Dual Core 32-bit LX6
clock frequency
240MHz
WiFi protocol
802.11b/g/n
rate
150Mbps
Protection interval
0.4us
Working channel frequency
2412-2484MHz
Bluetooth standard
V4.2BR/EDR/LE

Product Details

WiFi chip ESP32-PICO-V3 Lexin Technology dual core Wi Fi&Bluetooth system level packaging SiP module
WiFi chip ESP32-PICO-V3 Lexin Technology dual core Wi Fi&Bluetooth system level packaging SiP module
WiFi chip ESP32-PICO-V3 Lexin Technology dual core Wi Fi&Bluetooth system level packaging SiP module
WiFi chip ESP32-PICO-V3 Lexin Technology dual core Wi Fi&Bluetooth system level packaging SiP module
WiFi chip ESP32-PICO-V3 Lexin Technology dual core Wi Fi&Bluetooth system level packaging SiP module
WiFi chip ESP32-PICO-V3 Lexin Technology dual core Wi Fi&Bluetooth system level packaging SiP module
WiFi chip ESP32-PICO-V3 Lexin Technology dual core Wi Fi&Bluetooth system level packaging SiP module
WiFi chip ESP32-PICO-V3 Lexin Technology dual core Wi Fi&Bluetooth system level packaging SiP module
WiFi chip ESP32-PICO-V3 Lexin Technology dual core Wi Fi&Bluetooth system level packaging SiP module
WiFi chip ESP32-PICO-V3 Lexin Technology dual core Wi Fi&Bluetooth system level packaging SiP module

Trading Area

Global

Quotation

Name
Company
Phone
Email Address
Requirements
Quotation
Guangdong, China
Chat
Manufacturer
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