Overview
| brand | TPHI | Product Name | |
| model | TG-30 | working temperature | |
| Active ingredient content | ninety-nine | Product characteristics | Good thermal conductivity, extremely low thermal resistance, low stress, and high reliability for long-term use |
| Curing method | Active usage period | ||
| shear strength | Hot melt adhesive type | ||
| Resin adhesive classification | viscosity | ||
| Adhesive material type | Executive standards | ||
| Shelf life | Validity period | ||
| Imported or not | Packaging specifications | ||
| Scope of use | heat conduction | Thermal conductivity | 3.0W/mK |
| Product Application | IGBT and other power modules, LED chips, storage modules | colour | Silver Grey |
| Density (g/cc) | three point five | Viscosity (Pa · S) | one hundred |
| Volatile matter (150 ℃ * 24H) | <1% | Thermal conductivity (W/m · K) | three point one |
Product Details
Trading Area
Global