Overview
| brand | XM | model | |
| series | packing | box-packed | |
| Part status | On sale | type | |
| Number of layers | length | ||
| width | Thickness - Theory | ||
| size | 138 * 190 * 0.32 | basement | ceramics |
| Suspension method | Minimum packaging quantity | ten | |
| material quality | Silicon nitride | model | SN80 |
| Thermal conductivity | eighty | quantity | two hundred |
| density | three point two | encapsulation | AMB |
| colour | dark gray | Batch number | two thousand and twenty-three |
| Bending strength | 700Mpa | application | IGBT heat dissipation |
Product Details
SI3N4 ceramic substrate silicon nitride AMB ceramic substrate power module high thermal conductivity semiconductor silicon nitride substrate
Category: Precision Ceramics
Specification (mm): 138 * 190 * 0.32/0.25
Silicon nitride ceramic substrate has the advantages of high mechanical strength, high strength, low thermal expansion coefficient, low high-temperature creep, good oxidation resistance, good thermal corrosion performance, and low friction coefficient. Silicon nitride ceramic substrate copper clad plate has a wide range of applications in fields such as aerospace, automotive engines, mechanical and medical equipment, industrial kilns, and intelligent electronic equipment.
1. Silicon nitride ceramic substrate, also known as silicon nitride ceramic, is an inorganic material ceramic that does not shrink during sintering. The strength of silicon nitride is very high, especially hot pressed silicon nitride.
2. The thermal expansion coefficient of silicon nitride is around 3.0 times 10-6/degree Celsius, which is well matched with materials such as SI.SIC and caas. This makes silicon nitride ceramic circuit board substrates an attractive material for high-strength thermal conductive electronic device substrates.
3. Silicon nitride has a large current carrying capacity, greater than or equal to 300A, and a current carrying capacity greater than aluminum nitride ceramic substrate.
4. Silicon nitride ceramic substrate material has high fracture toughness and strong bending strength. Especially under high temperature conditions, silicon nitride ceramic materials exhibit mechanical properties such as high temperature resistance, chemical inertness to metals, high hardness, and fracture toughness. The bending strength and fracture heat resistance of silicon nitride can reach more than twice that of AIN ceramic matrix.
In terms of the shortcomings of 5 silicon nitride ceramic substrates, like ceramic substrates, the brittleness of silicon nitride ceramic substrates is also an aspect that affects reliability compared to other plates. In terms of organization, the comprehensive performance of silicon nitride ceramic substrates is very good.
Some specifications are available in stock, and special specifications can be molded and produced according to customer requirements
