Overview
| brand | Xintonglian Precision Technology | model | 8-layer soft and hard bonding board |
| Batch number | 8-layer soft and hard bonding board | encapsulation | Multi layer soft hard bonding board |
| packing | Vacuum packing | Minimum packaging quantity | 1 PCS |
| sample | Free sample collection | Processing method | Contract labor and materials |
| Processing type | OEM | quantity | nine thousand nine hundred and ninety-nine |
| Product category | Electronic components | specifications | Customizable |
| producing area | Shenzhen | material | Rubber free rolling copper |
| Number of layers | 8th floor | Plate thickness | 2.0 ± 0.3mm |
| Resistance welding | Yellow membrane | Minimum line width/line spacing | 0.06mm |
| Minimum drilling | 0.1mm | surface treatment | Gold plated 1U |
| Copper thickness | Inner and outer layer 2OZ | Fastest delivery time | 5 days |
Product Details
Trading Area
Global