Overview
| brand | Xintonglian Precision Technology | model | 12 layer thick gold testing semiconductor board |
| Batch number | 12 layer thick gold testing semiconductor board | encapsulation | multilayer |
| packing | vacuum | Minimum packaging quantity | provisional |
| sample | Free sample collection | Processing method | Contract labor and materials |
| Processing type | OEM | quantity | nine thousand nine hundred and ninety-nine |
| Product category | Electronic components | specifications | Customizable |
| producing area | Shenzhen | material | Shengyi s1000-2m |
| Number of layers | 12th floor | Plate thickness | 5.0 ± 0.5mm |
Product Details
Trading Area
Global