Overview
| brand | Xintonglian Precision Technology | model | 12 layer blind buried hole PCB board |
| Batch number | 12 layer thick gold testing semiconductor board | encapsulation | multilayer |
| packing | vacuum | Minimum packaging quantity | provisional |
| Processing method | Contract labor and materials | Processing type | OEM |
| quantity | nine thousand nine hundred and ninety-nine | Product category | Electronic components |
| specifications | Customizable | producing area | Shenzhen |
| material | Shengyi s1000-2m | Number of layers | 12th floor |
| Plate thickness | 5.0 ± 0.5mm | Minimum line width line spacing | 0.076mm |
| Minimum aperture | 0.15mm | ||
Product Details
Trading Area
Global