HI3559RBCV200 Haisi Electronic Components Security Camera Master Control Chip Packaging BGA Batch 22+
HI3559RBCV200 Haisi Electronic Components Security Camera Master Control Chip Packaging BGA Batch 22+
HI3559RBCV200 Haisi Electronic Components Security Camera Master Control Chip Packaging BGA Batch 22+
HI3559RBCV200 Haisi Electronic Components Security Camera Master Control Chip Packaging BGA Batch 22+
HI3559RBCV200 Haisi Electronic Components Security Camera Master Control Chip Packaging BGA Batch 22+
HI3559RBCV200 Haisi Electronic Components Security Camera Master Control Chip Packaging BGA Batch 22+

HI3559RBCV200 Haisi Electronic Components Security Camera Master Control Chip Packaging BGA Batch 22+

  • $23.00

    1-999 Unit

  • $21.00

    1000-9999 Unit

  • $17.00

    >=10000 Unit

Lead time
Quantity (Unit) 1-20000
Lead time (day)7
Module Number
HI3559RBCV200
Place of Origin
Shenzhen, Guangdong, China
Shipping
Air Freight

Product Description

Overview

brand
HISILICON
width
5.6mm
length
7.2mm
Maximum operating temperature
80C
Minimum operating temperature
50C
Minimum power supply voltage
4V
quantity
ten thousand
height
2.1mm
Maximum power supply voltage
6.5V
encapsulation
BGA

Product Details

The company guarantees that the product is brand new/original/official gene Product prices may be volatile with market changes Please consult customer service before placing an orderHI3559RBCV200 Haisi Electronic Components Security Camera Master Control Chip Packaging BGA Batch 22+HI3559RBCV200 Haisi Electronic Components Security Camera Master Control Chip Packaging BGA Batch 22+HI3559RBCV200 Haisi Electronic Components Security Camera Master Control Chip Packaging BGA Batch 22+HI3559RBCV200 Haisi Electronic Components Security Camera Master Control Chip Packaging BGA Batch 22+

Trading Area

Global

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