HI3518ERBCV200 Hisilicon Spot Electronic Component Master Chip Package BGA 22+
HI3518ERBCV200 Hisilicon Spot Electronic Component Master Chip Package BGA 22+
HI3518ERBCV200 Hisilicon Spot Electronic Component Master Chip Package BGA 22+
HI3518ERBCV200 Hisilicon Spot Electronic Component Master Chip Package BGA 22+
HI3518ERBCV200 Hisilicon Spot Electronic Component Master Chip Package BGA 22+
HI3518ERBCV200 Hisilicon Spot Electronic Component Master Chip Package BGA 22+

HI3518ERBCV200 Hisilicon Spot Electronic Component Master Chip Package BGA 22+

  • $14.00

    1-9 Unit

  • $13.50

    10-99 Unit

  • To Be Negociated

    >=100 Unit

Lead time
Quantity (Unit) 1-20000
Lead time (day)7
Module Number
HI3518ERBCV200
Place of Origin
Shenzhen, Guangdong, China
Shipping
Air Freight

Product Description

Overview

brand
Hisilicon
Maximum power supply voltage
7.5V
width
1mm
height
1.3mm
Minimum power supply voltage
3.5V
Maximum operating temperature
100C
series
HI3518
length
9.5mm
Minimum operating temperature
-30C
quantity
eight thousand nine hundred and ninety

Product Details

The company guarantees that the product is brand new/original/official gene Product prices may be volatile with market changes Please consult customer service before placing an orderHI3518ERBCV200 Hisilicon Spot Electronic Component Master Chip Package BGA 22+HI3518ERBCV200 Hisilicon Spot Electronic Component Master Chip Package BGA 22+HI3518ERBCV200 Hisilicon Spot Electronic Component Master Chip Package BGA 22+HI3518ERBCV200 Hisilicon Spot Electronic Component Master Chip Package BGA 22+

Trading Area

Global

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