Ordinary transparent glass laser marking machine 3W UV laser marking machine directly supplied by the manufacturer at the source

Product Overview

This equipment is a high-tech product that integrates laser, computer, automatic control, and precision machinery;
The term laser marking refers to carving, ablation, annealing, discoloration and foaming, coding and code spraying, and sometimes the term printing, marking, engraving, and marking is also used.
Usually, laser marking systems can achieve general marking processing,
Laser marking systems usually also have mechanical processing capabilities such as cutting, carving, drilling, polishing, marking, scraping, etc.

UV
One of the optical concepts;
The laser application industry generally refers to spectra with a typical wavelength value of 355nm;
Due to its "cold" light source characteristics, it has now shone brightly in the field of micro processing.

The main part of this equipment, the laser, normally uses Nd: YVO4 crystal (neodymium doped Yttrium orthovanadate crystal) as the gain medium,
It is an ideal choice for users with low energy requirements for single pulses and high repetition frequency requirements.
It adopts resonant cavity design and laser control methods to achieve better beam quality and narrower laser pulse width under high-power operation. Internal thermal compensation and harmonic conversion can achieve stable frequency doubling conversion.
High power, high pulse repetition rate, high pulse energy, and multi frequency adjustable pulse width are ideal for UV processing.
At present, the widely used ultraviolet solid-state lasers still need improvement in accuracy and speed.
But in short wavelength, narrow pulse width, small beam quality (high beam quality)
The performance of small heat affected zone+small spot diameter (direct vaporization of substances) is the same,
It can basically meet the general requirements of "cold" processing.


Currently in the field of micro processing of microelectronic materials
(Main application industries: electronic consumer mobile electronic devices), such as silicon (chip manufacturing), aluminum oxide (ceramic, microelectronic packaging), glass (touch screen manufacturing), copper (printed circuit board processing),
With the continuous influx of new materials, thin and brittle (10-20 μ m) The irregular characteristics have put forward many requirements for traditional laser processing methods.
In these aspects, short wavelength ultraviolet laser micro processing is of great benefit. Outstanding performance in reducing product defect rates, increasing production, and reducing costs.


Generally speaking,
In high-speed precision laser processing technology,
Wavelength, pulse width, average power, beam quality (M2), pulse repetition frequency (PRF), and energy stability between pulses, as well as newer pulse guidance and splitting, are important influencing factors on laser processing results.


Typical Process Application Cases of UV Part
1) Drilling:
Through holes, micropores, and blind buried holes, with a pore size of up to 10 μ m. It performs very eye-catching when drilling multiple layers.
2) Surface etching/circuit production:
The circuit traces etched with ultraviolet light are very small and can only be seen with a microscope.
For example, on a multi-layer structure composed of sintered ceramic substrate+tungsten/nickel/copper/surface with a size of 0.75 in * 0.5 in, the laser can generate circuit traces of 2 mils with a spacing of 1 mil, resulting in a total spacing of only 3 mils.
3) Flexible cutting:
This process is not only applicable to general microelectronic manufacturing processes, but also can be used in the surface stripping process for materials of various shapes and sizes.
For example, the pre welding removal of solder joint materials, the removal of surface materials from automotive oil pipes, etc,
4) Deep carving:
By using the software control of the laser system, the laser beam is set for controlled ablation, which allows cutting on a certain material at the required depth. Before turning to another depth and starting another task, the required processing can be stopped, continued, and completed.
Typical deep carving applications include:
The small-scale production used for embedding chips and surface grinding for removing organic materials from metal surfaces.
The above are all in the field of micro machining.

In industries closely related to people's lives, such as daily chemical and food products, packaging and related equipment industries,
For example, in some device industries, this process also plays an important role in the user experience of consumers (most of which are oral or implanted products that require no pathogenic pollution sources, a smooth surface, and traceability),
If the imprint is integrated with the base material, it is easy to track, identify, and crack down on counterfeiting; The quality of small light spots forms high-resolution markings;
Similarly, in other industries that require micro marking, ultraviolet laser marking can also play a very important role.
For example, electronic appliances (most of which are made of polymers such as plastic)

Typical Features

Energy saving: less consumable pollution (clean production environment without contact with workpieces), high electro-optical conversion rate and low energy consumption (cost saving);

Stable performance: high repetitive machining accuracy;
Marking content: diverse and flexible (to meet the needs of personalized markets);
Marking speed: fast and efficient, with controllable and visible marking process and results; Easy to operate, easy to learn, and quick to get started;
Marking results: Clear and delicate, integrated with the substrate and not easily detached;
Equipment structure: compact, compact, stable, and highly integrated.

The main feature of UV laser marking is "cold processing"
Different from the processing method of local heating and conduction of visible light and infrared light to promote the melting or gasification of substances to produce marking, separation and connection, processing methods such as ultraviolet marking (marking means the same) can directly destroy the Chemical bond of the atomic components of the connected substances, thus ensuring the edge strength and micro processing size effect. The meaning of 'cold light source' lies in this.

Applicable scope  

In addition to general materials, this process equipment is also suitable for the following materials and related industries:
※ Silicon wafers, LCD screens, ceramics, thin films, PCB boards, glass, metal and its alloy oxides and coatings
Scoring, micropores, cutting, and marking of other polymer materials.
※ Industries such as food, cosmetics, gifts, cables, electronic appliances, building materials and hardware, as well as scientific research and experiments.
The UV processing system can perform laser processes such as marking, carving, cutting (marking, scoring, and punching) on the industries and materials mentioned above.
Although its high power production is difficult, processing speed is slow, and its relatively high price has slowed down its significant application in most industries,
But its performance in the fields of fine marking and micro processing is very eye-catching,
Moreover, the research and development and production of domestically produced ultraviolet lasers are becoming increasingly mature, and their application scope will also become wider and wider.

You can inquire by phone or email about the suitability and economy of specific materials. Generally speaking, we try to recommend a solution that balances stability and economy.
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Basic technical parameters