Overview
| brand | Wuhan Keyi Optoelectronics | brand | Wuhan Keyi |
| Processing customization | yes | Specification and model | KY-M |
| Print Range | 110 (110 (mm) | Print Depth | 0.01mm~2mm |
| Print height | 580mm | Printing speed | 7000mm/s |
| Applicable industries | Food, medicine, hardware, machinery, gifts | type | Laser marking machine |
| Saleable land | nationwide | after-sale service | Whole machine warranty for one year, lifetime maintenance |
Product Details
Overview
This equipment belongs to a typical application of laser marking, a traditional laser heat treatment process, in the surface treatment of new materials (such as semiconductor thermoelectric materials).
At the same time, the flexible performance of laser equipment is utilized, and the multi station structure enables the beam to process up to 12 workstation workpiece tasks in a short time, while maintaining a balanced and consistent power density to ensure the consistency of laser processing results, such as processing layer thickness, edge accuracy, etc.
Traditional surface treatment methods, such as spray electroplating, have the characteristics of multiple processes, complex processes (some of which also have certain environmental pollution), low yield, and high cost.
The laser processing method benefits from the high controllability of laser beams with certain characteristics from being generated in the laser to reaching the surface of the workpiece.
As is well known, the interaction process between materials and lasers directly reflects the feasibility of the process.
A specific laser has specific parameters such as pulse frequency, pulse width, and spot size (some light sources can also adjust these parameters to achieve special processes). When it reaches the surface of the material, the high-energy laser beam can generate a large amount of heat instantly and transmit it to the transverse and longitudinal surfaces of the material, resulting in surface process results such as removal and passivation.
In this process, the generation and transmission of heat is closely related to the laser. Modern pulsed laser has a good electrothermal optical conversion efficiency for most materials, and the cost is also low. Technically, it can accurately control the time of laser beam occurrence, unit power density distribution and other spatio-temporal parameters (conventional nanosecond level), so as to obtain process results such as good edge appearance, uniform range, uniform longitudinal thickness, etc.
One of the current applications of this equipment is to use laser to scan the surface of Bismuth telluride based semiconductor thermoelectric materials (such as refrigeration and heating devices) to form a passivation and coarsening layer for the convenience of subsequent processes such as electroplating surface activation. After this laser process, the solid bonding strength of the coating increases.
Equipment parameters