Overview
| model | LX3352 | specifications | |
| brand | Landcore Semiconductor | Processing customization | |
| application area | IC, QFN, DFN, LED substrate, optical communication and other industries | Cuttable material | Silicon wafers, ceramics, glass, alumina, PCB, alumina, lithium niobate, quartz, etc |
| product | Precision scoring machine | Cutting accuracy | 0.0001mm |
| Calibration mode | Manual, automatic | Speed range | 6000-60000 rpm |
| compressed air | 0.5-0.8Mpa high gas consumption 220L/min | size | 1075 * 1160 * 1810mm |
Product Details
The LX3352 precision scoring machine is equipped with a 1.8kw high-power DC spindle; High rigidity portal structure; T-axis DD motor drive; Imported high-precision screw and guide rail; Dual lens alignment; Further enhancement of software functionality and significant improvement in automation; It can widely meet various processing needs. LX3352 cutting compatible with 8-12 inches.
Landcore Semiconductor is a diversified company specializing in the research and development, sales, consulting, and service of semiconductor specialized equipment and accessory consumables. Our main products include wafer cutting machines, precision cutting machines, wafer cutting machines, and silicon wafer cutting. Our precision wafer cutting machines require diamond grinding wheels to cut different materials such as wafers, silicon wafers, gallium arsenide, lithium niobate, alumina, ceramics, glass, quartz, sapphire, and circuit boards, Our precision slicing machine is used in various fields such as diodes, transistors, MEMS, medical devices, solar cells, NTC, IC, etc
| Qianyu Wangpu | https://58340.qianyuwang.com/ |