HI3519RFCV101 Hisilicon IC chip Integrated circuit packaging BGA batch 20+new original packaging off the shelf

HI3519RFCV101 Hisilicon IC chip Integrated circuit packaging BGA batch 20+new original packaging off the shelf

$107.00
100-999 Unit
$102.00
1000-9999 Unit
To Be Negociated
>=10000 Unit

Lead time

Quantity (Unit)	1-100	101-1000	1001-10000
Lead time (day)	1	3	7

Module Number

HI3519RFCV101

Place of Origin

Shenzhen, Guangdong, China

Shipping

Air Freight

Product Description

Overview

Brand	Hisilicon	Producing area	China
Encapsulation	BGA	Batch number	20+
Minimum operating temperature	-40C	Maximum operating temperature	100C
Minimum power supply voltage	5V	Maximum power supply voltage	9.5V
Length	7.3mm	Width	8.9mm
Height	1.3mm	Quantity	Fourteenthousand

Product Details

The company guarantees that the product is brand new/original/official gene Product prices may be volatile with market changes Please consult customer service before placing an order

HI3519RFCV101 Hisilicon IC chip Integrated circuit packaging BGA batch 20+new original packaging off the shelf

Trading Area

Global

Quotation

Guangdong, China

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