HI3516ERBCV300 Hisilicon New Original Spot Integrated Circuit Master Control Chip Package BGA Batch 22+
HI3516ERBCV300 Hisilicon New Original Spot Integrated Circuit Master Control Chip Package BGA Batch 22+
HI3516ERBCV300 Hisilicon New Original Spot Integrated Circuit Master Control Chip Package BGA Batch 22+
HI3516ERBCV300 Hisilicon New Original Spot Integrated Circuit Master Control Chip Package BGA Batch 22+
HI3516ERBCV300 Hisilicon New Original Spot Integrated Circuit Master Control Chip Package BGA Batch 22+
HI3516ERBCV300 Hisilicon New Original Spot Integrated Circuit Master Control Chip Package BGA Batch 22+

HI3516ERBCV300 Hisilicon New Original Spot Integrated Circuit Master Control Chip Package BGA Batch 22+

  • $21.00

    100-999 Unit

  • $19.00

    1000-9999 Unit

  • To Be Negociated

    >=10000 Unit

Lead time
Quantity (Unit) 1-100101-10001001-10000
Lead time (day)137
Module Number
HI3516ERBCV300
Place of Origin
Shenzhen, Guangdong, China
Shipping
Air Freight

Product Description

Overview

Brand
Hisilicon
Producing area
China
Encapsulation
BGA
Batch number
20+
Minimum operating temperature
-40C
Maximum operating temperature
9C
Minimum power supply voltage
3V
Maximum power supply voltage
8V
Length
6mm
Width
5mm
Height
1.4mm
Quantity
Fourteenthousand

Product Details

The company guarantees that the product is brand new/original/official gene Product prices may be volatile with market changes Please consult customer service before placing an order

HI3516ERBCV300 Hisilicon New Original Spot Integrated Circuit Master Control Chip Package BGA Batch 22+HI3516ERBCV300 Hisilicon New Original Spot Integrated Circuit Master Control Chip Package BGA Batch 22+HI3516ERBCV300 Hisilicon New Original Spot Integrated Circuit Master Control Chip Package BGA Batch 22+

HI3516ERBCV300 Hisilicon New Original Spot Integrated Circuit Master Control Chip Package BGA Batch 22+HI3516ERBCV300 Hisilicon New Original Spot Integrated Circuit Master Control Chip Package BGA Batch 22+

Trading Area

Global

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