Overview
| brand | Xilinx | model | XC3S200-4FTG256I |
| Packaging/Specifications | packing | ||
| Certification Authority | Minimum packaging quantity | ||
| quantity | nine hundred | manufacturer | Xilinx |
| Product category | FPGA - Field Programmable Gate Array | RoHS | yes |
| Number of logical elements | four thousand three hundred and twenty | Number of input/output terminals | 173 I/O |
| Working power supply voltage | 1.2 V | Minimum operating temperature | -40 C |
| Maximum operating temperature | +100 C | Installation style | SMD/SMT |
| Packaging/Box | FBGA-256 | series | XC3S200 |
| Number of gates | two hundred thousand | distributed ram | 30 kbit |
| Embedded Block RAM - EBR | 216 kbit | Maximum operating frequency | 280 MHz |
| Humidity sensitivity | Yes | ||
Product Details
technical parameter
| Brand: | Xilinx |
| Model: | XC3S200-4FTG256I |
| Quantity: | nine hundred |
| Manufacturer: | Xilinx |
| Product type: | FPGA - Field Programmable Gate Array |
| RoHS: | yes |
| Number of logical elements: | four thousand three hundred and twenty |
| Number of input/output terminals: | 173 I/O |
| Working power supply voltage: | 1.2 V |
| Minimum operating temperature: | -40 C |
| Maximum operating temperature: | +100 C |
| Installation style: | SMD/SMT |
| Packaging/Box: | FBGA-256 |
| Series: | XC3S200 |
| Number of gates: | two hundred thousand |
| Distributed RAM: | 30 kbit |
| Embedded Block RAM - EBR: | 216 kbit |
| Maximum operating frequency: | 280 MHz |
| Humidity sensitivity: | Yes |
Trading Area
Global