Bo Jie Xin LX3352 Precision Scoring Machine Mobile Phone Silicon Carbide Cutting Machine Semiconductor Chip Cutting Process
Bo Jie Xin LX3352 Precision Scoring Machine Mobile Phone Silicon Carbide Cutting Machine Semiconductor Chip Cutting Process
Bo Jie Xin LX3352 Precision Scoring Machine Mobile Phone Silicon Carbide Cutting Machine Semiconductor Chip Cutting Process
Bo Jie Xin LX3352 Precision Scoring Machine Mobile Phone Silicon Carbide Cutting Machine Semiconductor Chip Cutting Process
Bo Jie Xin LX3352 Precision Scoring Machine Mobile Phone Silicon Carbide Cutting Machine Semiconductor Chip Cutting Process
Bo Jie Xin LX3352 Precision Scoring Machine Mobile Phone Silicon Carbide Cutting Machine Semiconductor Chip Cutting Process

Bo Jie Xin LX3352 Precision Scoring Machine Mobile Phone Silicon Carbide Cutting Machine Semiconductor Chip Cutting Process

$69,686.41/Stand
Place of Origin
China
Shipping
Air Freight, Ocean Freight, Land Freight

Product Description

Overview

brand
Bojie Core
model
LX3352
specifications
Processing customization
application area
IC, QFN, DFN, LED substrate, optical communication and other industries
Cuttable material
Silicon wafers, ceramics, glass, alumina, PCB, alumina, lithium niobate, quartz, etc
product
Precision scoring machine
Cutting accuracy
0.0001mm
Calibration mode
Manual, automatic
Speed range
6000-60000 rpm
compressed air
0.5-0.8Mpa high gas consumption 220L/min
size
1075 * 1160 * 1810mm

Product Details

Bo Jie Xin LX3352 Precision Scoring Machine Mobile Phone Silicon Carbide Cutting Machine Semiconductor Chip Cutting Process
Bo Jie Xin LX3352 Precision Scoring Machine Mobile Phone Silicon Carbide Cutting Machine Semiconductor Chip Cutting Process
Bo Jie Xin LX3352 Precision Scoring Machine Mobile Phone Silicon Carbide Cutting Machine Semiconductor Chip Cutting Process
Bo Jie Xin LX3352 Precision Scoring Machine Mobile Phone Silicon Carbide Cutting Machine Semiconductor Chip Cutting Process
Bo Jie Xin LX3352 Precision Scoring Machine Mobile Phone Silicon Carbide Cutting Machine Semiconductor Chip Cutting Process
Bo Jie Xin LX3352 Precision Scoring Machine Mobile Phone Silicon Carbide Cutting Machine Semiconductor Chip Cutting Process
Bo Jie Xin LX3352 Precision Scoring Machine Mobile Phone Silicon Carbide Cutting Machine Semiconductor Chip Cutting Process
Bo Jie Xin LX3352 Precision Scoring Machine Mobile Phone Silicon Carbide Cutting Machine Semiconductor Chip Cutting Process
Bo Jie Xin LX3352 Precision Scoring Machine Mobile Phone Silicon Carbide Cutting Machine Semiconductor Chip Cutting Process

Trading Area

Global

Quotation

Name
Company
Phone
Email Address
Requirements
Quotation
Bojiexin (Shenzhen) Semiconductor Co., Ltd
, China
Chat
  • Contact
  • chuhaiyi@baidu.com
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