Overview
| brand | Xintonglian Precision Technology | model | 10 layer soft hard bonding board |
| Batch number | 10 layer high-end electronic device board | encapsulation | multilayer |
| packing | vacuum | Minimum packaging quantity | 1 PCS |
| Processing method | Contract labor and materials | Maximum number of floors | 22nd floor |
| quantity | ninety-nine thousand nine hundred and ninety-nine | Product category | Electronic components |
| specifications | Customizable | producing area | Shenzhen |
| material | Shengyi s1000-2m | Plate thickness | 2.0 ± 0.1mm |
| Resistance welding | Yellow film white character | Minimum line width line spacing | 0.045mm |
| Minimum aperture | 0.07mm | surface treatment | Gold plated 3U |
| Number of bends | 20000 times | Withstand voltage | 1000V |
| level | Military Industry | grade | A-level |
Product Details
Trading Area
Global