Overview
| brand | Huachuang Materials | CAS number | |
| Molecular formula | Product Name | Low temperature fast curing epoxy adhesive | |
| model | H907-KM | working temperature | eighty |
| Product characteristics | Single component low-temperature fast curing epoxy adhesive with excellent low-temperature fast curing properties, strong adhesive strength, good toughness, and excellent electrical insulation | Curing method | Heating curing |
| viscosity | 15000-25000 cps | Adhesive material type | Electronic components |
| Imported or not | no | Packaging specifications | one |
| Scope of use | Widely used for bonding and curing various electronic component components, camera mold components, various plastic products, metal products, etc. | Shelf life | three |
| Validity period | 25 degrees for 2 months, 5 degrees for 3 months | Curing conditions | 75-80 ℃/15-20 minutes, 120 ° C for 3-5 minutes |
| colour | black | Viscosity | Consulting customer service |
| Customized communication | support | ROHS | accord with |
| Low halogen | YES | Resin adhesive classification | Epoxy resin adhesive |
| grading of products | excellent | Large volume discounts | YES |
| hardness | 85-87Shoe D | ||
Product Details
Trading Area
Global