Weichen Technology bonding machine is suitable for MEMS integrated circuits and internal wire welding
Weichen Technology bonding machine is suitable for MEMS integrated circuits and internal wire welding
Weichen Technology bonding machine is suitable for MEMS integrated circuits and internal wire welding
Weichen Technology bonding machine is suitable for MEMS integrated circuits and internal wire welding
Weichen Technology bonding machine is suitable for MEMS integrated circuits and internal wire welding
Weichen Technology bonding machine is suitable for MEMS integrated circuits and internal wire welding

Weichen Technology bonding machine is suitable for MEMS integrated circuits and internal wire welding

$186.99
Place of Origin
China
Shipping
Air Freight, Ocean Freight, Land Freight

Product Description

Overview

brand
Weichen
Does it support processing customization
specifications
model
Using the power supply
220VAC ± 10%, 50Hz, reliably grounded
Power consumption
Maximum 300W
Applicable wire diameter
17~50 μ M (0.8-2mil)
welding temperature
60-400 ℃
Ultrasonic power
Four channel 0-3W continuously adjustable in two levels
Welding time
Two channel 0-100ms
Welding pressure
Second channel 35-180g
Maximum automatic span
Not less than 4mm in both directions
Tail length
0-2mm
Golden Ball Size
2-4 times the wire diameter can be set arbitrarily
Minimum welding time
0.4s/line
vision system
Second level (15-30x) microscope
Fixture movement range
Φ 25mm
Overall dimensions
seven hundred × four hundred and sixty × 550mm
Weight
About 30KG

Product Details

Weichen Technology bonding machine is suitable for MEMS integrated circuits and internal wire welding
Weichen Technology bonding machine is suitable for MEMS integrated circuits and internal wire welding
Weichen Technology bonding machine is suitable for MEMS integrated circuits and internal wire welding
Weichen Technology bonding machine is suitable for MEMS integrated circuits and internal wire welding

Trading Area

Global

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