Weichen Supply WE-2013 Gold Wire Ball Soldering Machine Semiconductor Packaging Equipment
Weichen Supply WE-2013 Gold Wire Ball Soldering Machine Semiconductor Packaging Equipment
Weichen Supply WE-2013 Gold Wire Ball Soldering Machine Semiconductor Packaging Equipment
Weichen Supply WE-2013 Gold Wire Ball Soldering Machine Semiconductor Packaging Equipment
Weichen Supply WE-2013 Gold Wire Ball Soldering Machine Semiconductor Packaging Equipment
Weichen Supply WE-2013 Gold Wire Ball Soldering Machine Semiconductor Packaging Equipment

Weichen Supply WE-2013 Gold Wire Ball Soldering Machine Semiconductor Packaging Equipment

$851.05
Place of Origin
China
Shipping
Air Freight, Ocean Freight, Land Freight

Product Description

Overview

brand
Weichen
Does it support processing customization
specifications
model
Using the power supply
220VAC ± 10%, 50Hz, reliably grounded
Power consumption
Maximum 300W
Applicable wire diameter
17~50 μ M (0.8-2mil)
welding temperature
60-400 ℃
Ultrasonic power
Four channel 0-3W continuously adjustable in two levels
Welding time
Two channel 0-100ms
Welding pressure
Second channel 35-180g
Maximum automatic span
4mm
Tail length
0-2mm
Golden Ball Size
2-4 times
Minimum welding time
0.4s/line
vision system
15-30x
Fixture movement range
Φ 25mm
Overall dimensions
seven hundred × four hundred and sixty × 550mm
Weight
About 30KG

Product Details

Weichen Supply WE-2013 Gold Wire Ball Soldering Machine Semiconductor Packaging Equipment
Weichen Supply WE-2013 Gold Wire Ball Soldering Machine Semiconductor Packaging Equipment
Weichen Supply WE-2013 Gold Wire Ball Soldering Machine Semiconductor Packaging Equipment
Weichen Supply WE-2013 Gold Wire Ball Soldering Machine Semiconductor Packaging Equipment
Weichen Supply WE-2013 Gold Wire Ball Soldering Machine Semiconductor Packaging Equipment

Trading Area

Global

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