Overview
| brand | Xintonglian Precision Technology | model | 20 layer server high-level backplane PCB |
| Batch number | 20 layer server high-level backplane PCB | encapsulation | multilayer |
| packing | vacuum | Minimum packaging quantity | 1 PCS |
| Delivery date | 12 days | Processing method | Contract labor and materials |
| Processing type | OEM | quantity | nine thousand nine hundred and ninety-nine |
| Product category | Electronic components | specifications | Customizable |
| producing area | Shenzhen | material | Taiyao TU-872 |
| Number of layers | 20th floor | Plate thickness | 2.0 ± 0.2mm |
| Minimum aperture | zero point two five | surface treatment | Electric gold 10U |
| Minimum line width line spacing | 0.08mm | Resistance welding | Green oil |
Product Details
Trading Area
Global