Overview
| brand | Huaxin Technology | model | |
| material | length | ||
| width | function | ||
| type | Unit weight | ||
| packing | Vacuum packing | Copper clad plate/substrate | |
| Minimum packaging quantity | box-packed | quantity | ten thousand |
| Plate thickness | 8mil | Copper thickness | H/H H1/H1 |
| size | 18 * 24 inches | batch | 2022+ |
| Number of layers | two | surface treatment | Sinking gold |
| Resistance welding | green | character | white |
| density | V-0 | Place of shipment | Shenzhen |
| Lead free soldering compatibility | yes | Sellable region | nationwide |
| encapsulation | yes | Batch number | Available |
Product Details
Trading Area
Global