CMC (Cu/Mo/Cu)

CMC is a sandwich structure composite plate clad with oxygen-free copper plate on both sides of the molybdenum plate. It combines the low coefficient of thermal expansion of molybdenum with the high thermal conductivity of copper. The surface is covered with copper, so the electroplating is extremely convenient. 

S-CMC is a multi-layer structure CMC. HS-CMC is a multi-layer composite plate with holes in the core molybdenum plate which are filled with oxygen-free copper, so that it has better thermal conductivity in the Z direction. It is an original product invented by our team in cooperation with Kyocera for 5G power devices.

Our CMC can be stamped into lamellar structure, while that of our competitors does not have stampability. The layer thickness ratio of CMC materials can be adjusted to obtain different coefficients of thermal expansion.